Tactile Sensing System Module with Multiple Cmos-Mems Integrated Sensors on 16 Mbps High Speed Shared Serial Bus Line
Chenzhong Shao, Hideki Hirano, M. Nomoto, Hiroshi Miyaguchi, Takahiro Nakayama, Yoshiyuki Hata, Motohiro Fujiyoshi, Masanori Muroyama, Shuji Tanaka
- Year
- 2019
- Citations
- 3
Abstract
This paper presents a PCB-based system module including 5 CMOS-MEMS integrated sensors for robot fingertip tactile sensing. The sensor used in the module has 3-axis capacitive force sensation with 2.7 mm square footprint and integrates our original sensor platform LSI fabricated by TSMC0.13μm CMOS process. Five integrated sensors are mounted on a shared serial bus with a high-dense pitch of 9 mm and communicate with an FPGA-based relay node through RS-485 compatible differential signaling. We confirmed that these 5 integrated sensors operated simultaneously on the serial bus with a high data rate up to 16 Mbps.
Keywords
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