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Tactile Sensing System Module with Multiple Cmos-Mems Integrated Sensors on 16 Mbps High Speed Shared Serial Bus Line

Chenzhong Shao, Hideki Hirano, M. Nomoto, Hiroshi Miyaguchi, Takahiro Nakayama, Yoshiyuki Hata, Motohiro Fujiyoshi, Masanori Muroyama, Shuji Tanaka

Year
2019
Citations
3

Abstract

This paper presents a PCB-based system module including 5 CMOS-MEMS integrated sensors for robot fingertip tactile sensing. The sensor used in the module has 3-axis capacitive force sensation with 2.7 mm square footprint and integrates our original sensor platform LSI fabricated by TSMC0.13μm CMOS process. Five integrated sensors are mounted on a shared serial bus with a high-dense pitch of 9 mm and communicate with an FPGA-based relay node through RS-485 compatible differential signaling. We confirmed that these 5 integrated sensors operated simultaneously on the serial bus with a high data rate up to 16 Mbps.

Keywords

Tactile sensorComputer hardwareCMOSSerial communicationField-programmable gate arrayComputer scienceRelayFootprintEmbedded systemCapacitive sensing

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