Thierry Mourier
Laboratoire d'Électronique des Technologies de l'Information
Papers
1
Total Citations
2
H-Index
1
About
Thierry Mourier is a leading expert in advanced semiconductor packaging and 3D integration technologies, with a particular focus on applications for autonomous driving and mobile LiDAR systems. His research centers on the development and evaluation of Through-Silicon Via (TSV) and flip chip technologies, addressing the stringent reliability and performance requirements of next-generation automotive sensors. Mourier’s major contribution lies in demonstrating how advanced packaging solutions can enable the miniaturization and robustness needed for 256-channel beam steering devices in autonomous vehicles. His 2023 paper on this topic, which has garnered early citations, showcases his work at the intersection of packaging engineering and autonomous driving systems. By tackling critical challenges in heat dissipation, signal integrity, and mechanical stability, Mourier’s research directly supports the commercial viability of LiDAR for ADAS. His work is essential reading for engineers and researchers developing high-performance sensor modules, as it bridges the gap between theoretical packaging concepts and real-world automotive deployment.
Research Focus
Key Achievements
Top Papers
- 1