Papers
1
Total Citations
2
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About
Natacha Raphoz is a leading expert in advanced semiconductor packaging and 3D integration, with a focused specialization in the packaging of LiDAR systems for autonomous driving and robotics. Her work addresses the critical challenge of meeting stringent automotive-grade reliability standards while enabling the high-performance, compact beam-steering devices required for next-generation autonomous vehicles. Her most cited paper, “Advanced 3D integration TSV and flip chip technologies evaluation for the packaging of a mobile LiDAR 256 channels beam steering device,” provides a foundational evaluation of Through-Silicon Via (TSV) and flip-chip technologies, demonstrating how these advanced packaging solutions can satisfy the rigorous demands of automotive suppliers. This contribution is pivotal for bridging the gap between LiDAR component innovation and real-world automotive deployment. With 2 citations in a highly specialized field, her work is recognized by peers for its practical, industry-facing impact. Raphoz’s research is essential for students and engineers seeking to understand the packaging constraints that will define the future of autonomous sensing.
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