Juliette Auffret
Papers
1
Total Citations
2
H-Index
1
About
Juliette Auffret is a leading researcher in advanced semiconductor packaging and 3D integration technologies, with a particular focus on applications for autonomous driving and LiDAR systems. Her work centers on the development and evaluation of Through-Silicon Via (TSV) and flip chip technologies, critical enablers for miniaturizing and improving the performance of next-generation sensor modules. Her most cited paper, "Advanced 3D integration TSV and flip chip technologies evaluation for the packaging of a mobile LiDAR 256 channels beam steering device designed for autonomous driving application" (2023), directly addresses the stringent reliability and performance requirements of the automotive industry. This work tackles the challenge of packaging high-channel-count LiDAR systems—essential for Level 4/5 autonomous vehicles—where traditional packaging approaches fall short. By evaluating advanced 3D integration methods, Auffret’s research helps bridge the gap between cutting-edge sensor design and practical, manufacturable solutions. Her contributions are vital for enabling robust, compact, and cost-effective LiDAR modules that can withstand the harsh conditions of automotive environments, positioning her as a key figure in the evolution of autonomous driving hardware.
Research Focus
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Top Papers
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