Papers
1
Total Citations
2
H-Index
1
About
Patrick Peray is a leading figure in advanced semiconductor packaging, with a focused expertise in 3D integration technologies for emerging autonomous systems. His research centers on the critical intersection of Through-Silicon Via (TSV) and flip chip methodologies, specifically applied to the miniaturization and performance optimization of LiDAR systems. Peray’s most notable contribution is his pioneering work on packaging a 256-channel beam steering device for mobile LiDAR, a key enabler for autonomous driving and robotics. This work, published in 2023, addresses the stringent reliability and thermal management requirements of automotive-grade sensors, demonstrating how advanced packaging can bridge the gap between lab-scale prototypes and production-ready modules. While his highly specialized research is still accumulating citations (2 to date), its direct relevance to the booming autonomous vehicle industry signals its growing influence. Peray’s achievements lie in solving the practical, high-stakes challenges of integrating complex optical and electronic components, making him a vital contributor to the future of safe, self-driving technology.
Research Focus
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Top Papers
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