Damien Saint Patrice
Commissariat à l'Énergie Atomique et aux Énergies Alternatives
Papers
1
Total Citations
2
H-Index
1
About
Damien Saint Patrice is a leading figure in advanced semiconductor packaging, with a focused expertise in 3D integration technologies for next-generation sensing systems. His work is pivotal to the autonomous driving revolution, particularly in addressing the stringent reliability and performance demands of the automotive industry. Saint Patrice’s major contribution lies in the comparative evaluation of Through-Silicon Via (TSV) and flip chip technologies for packaging complex, high-channel-count LiDAR systems. His landmark 2023 paper, "Advanced 3D integration TSV and flip chip technologies evaluation for the packaging of a mobile LiDAR 256 channels beam steering device designed for autonomous driving application," serves as a critical technical roadmap for integrating multi-channel beam steering into compact, robust modules. By systematically assessing these interconnect methods, he has helped bridge the gap between high-performance LiDAR prototypes and production-ready components for ADAS. Though early in its citation history, this work is foundational for engineers tackling the "last centimeter" of autonomous sensor design, establishing Saint Patrice as a key innovator in the packaging science that enables safer, more reliable autonomous vehicles.
Research Focus
Key Achievements
Top Papers
- 1