Flip chip

Flip chip bonding on stretchable printed substrates; the effects of stretchable material and chip encapsulation

Muhammad Hassan Malik, Jaroslaw Kaczynski, Hubert Zangl, Ali Roshanghias

Citations: 7 • 2023

Flip chip equipment for high end electro-optical modules

Keith A. Cooper, Ruimin Yang, Jean-Stephane Mottet, Gilbert Lecarpentier

Citations: 7 • 2002

Highly Thermal Dissipation for Large HPC Package Using Liquid Metal Materials

Yu Lung Huang, C. Key Chung, C. F. Lin, Kuo Haw Yu, Rung Jeng Lin, Wilson Hong

Citations: 6 • 2021

An automated flip-chip assembly technology for advanced VLSI packaging

M.K. Bartschat

Citations: 6 • 2003

<title>Positioning strategies and sensor integration in tools for assembling MOEMS</title>

Günther Reinhart, Dirk Jacob

Citations: 6 • 2000

Heterogeneous integration of optoelectronic components

C. Fan, D.W. Shih, M. Hansen, Daniel M. Hartmann, D.A. Van Blerkom, Sadik C. Esener, Michael J. Heller

Citations: 4 • 1997

Effects of BN and SiC nanoparticles on properties of conductive adhesive

Huaxiang Lai, Xiuzhen Lu, Hui‐Wang Cui, Xiaohua Liu, Si Chen, Tian‐An Chen, Johan Liu

Citations: 4 • 2010

<title>Flip-chip electronic system assembly process and issues for the NanoWalker: a small wireless autonomous instrumented robot</title>

Sylvain Martel, George A. Riley, Monisha Merchant, Ian W. Hunter, S. Lafontaine

Citations: 3 • 1999

Advanced 3D integration TSV and flip chip technologies evaluation for the packaging of a mobile LiDAR 256 channels beam steering device designed for autonomous driving application

Thierry Mourier, Nadia Miloud-Ali Berchet, Juliette Auffret, Natacha Raphoz, Yacoub Sahouane, Damien Saint Patrice, Edouard Deschaseaux, Patrick Peray, Sylvain Guerber, François Simoens

Citations: 2 • 2023

Fine pitch and high density Sn bump fabrication

Jinglin Bi, Jin Jiang, Anmin Hu, Ming Li, Dali Mao, Tadatomo Suga

Citations: 2 • 2009

CAD Needs for Flip Chip Coplanar Waveguide Monolithic Microwave Integrated Circuit Technology

Chunming Wen, Michael Cole, C.K. Pao, R. F. Wang

Citations: 2 • 1997