Electroplating

Microfabricated Deposition Nozzles for Direct‐Write Assembly of Three‐Dimensional Periodic Structures

Rama B. Rao, Karen Lee Krafcik, Alfredo Morales, Jennifer A. Lewis

Citations: 111 • 2005

Physical Principles of Ionic Polymer–Metal Composites as Electroactive Actuators and Sensors

Il‐Seok Park, Kwangmok Jung, Doyeon Kim, Sang-Mun Kim, Kwang J. Kim

Citations: 50 • 2008

Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires

Miku J. Laakso, Simon J. Bleiker, Jessica Liljeholm, Gustaf Mårtensson, Mikhail Asiatici, Andreas Fischer, Göran Stemme, Thorbjörn Ebefors, Frank Niklaus

Citations: 38 • 2018

Recent progress in preparation process of ionic polymer-metal composites

Liang Yang, Hong Wang, Xining Zhang

Citations: 38 • 2021

A Nearly Packaging‐Free Design Paradigm for Light, Powerful, and Energy‐Dense Primary Microbatteries

Xiujun Yue, Alissa C. Johnson, Sungbong Kim, Ryan R. Kohlmeyer, Arghya Patra, Jessica Grzyb, Akaash Padmanabha, Min Wang, Zhimin Jiang, Pengcheng Sun, Chadd Kiggins, Mehmet Nurullah Ateş, Sonika V. Singh, Evan M. Beale, M. L. Daroux, Aaron J. Blake, John B. Cook, Paul V. Braun, James H. Pikul

Citations: 37 • 2021

Binuclear Copper Complex Ink as a Seed for Electroless Copper Plating Yielding >70% Bulk Conductivity on 3D Printed Polymers

Yousef Farraj, Michael Layani, Avi Yaverboim, Shlomo Magdassi

Citations: 26 • 2018

Optimal Scheduling of Material Handling Devices in a PCB Production Line: Problem Formulation and a Polynomial Algorithm

Ada Che, Chengbin Chu

Citations: 25 • 2008

Copper deposition on textiles via an automated dispensing process for flexible microstrip antennas

Bing Li, Dapeng Li, Jiping Wang

Citations: 21 • 2014

A sub-micron metallic electrothermal gripper

Daniel Sang-Won Park, Arun K. Nallani, DonKyu Cha, Gil-Sik Lee, Moon J. Kim, George D. Skidmore, Jeong‐Bong Lee

Citations: 12 • 2009

Thin cathodically electroplated chalcogenide-based ion-selective membranes for flow-injection application

M. Neshkova

Citations: 6 • 2000

Micromachined capacitors based on automated multilayer electroplating

Seong-Hyok Kim, Urvi Shah, Mark G. Allen

Citations: 5 • 2010

Electrochemical Deposition of Copper on Polymer Fibers

Seung-Lin Lim, Jaecheon Kim, Jongdeok Park, Sohee Kim, Jae‐Joon Lee

Citations: 3 • 2016

Permanent Cathode Technologies in Copper Electrowinning: Development and Status

Kathryn Naidoo, Kathryn C. Sole

Citations: 1 • 2025