Xingfeng Lei

Papers

Total Citations

500

H-Index

About

Xingfeng Lei is a pioneering materials scientist whose work sits at the intersection of polymer chemistry and flexible electronics. His research focuses on developing advanced dynamic covalent thermoset nanocomposites for next-generation wearable technologies. Lei’s most transformative contribution is the creation of the first fully recyclable and rehealable electronic skin (e-skin), reported in his landmark 2018 paper, which has garnered over 500 citations. Unlike conventional e-skins that degrade after damage, Lei’s design utilizes robust dynamic covalent bonds within a thermoset matrix, enabling the material to be repeatedly healed, fully recycled, and reprocessed without loss of performance. This breakthrough addresses critical sustainability and durability challenges in soft electronics, offering a path toward truly circular electronic devices. His work has been widely recognized for bridging the gap between the mechanical compliance of natural skin and the chemical stability required for real-world applications. By demonstrating that high-performance, malleable e-skins can be both chemically robust and environmentally friendly, Lei has established himself as a leading voice in sustainable flexible electronics.