Nur Filzati Farihah Othman
Papers
1
Total Citations
2
H-Index
1
About
Nur Filzati Farihah Othman is a researcher focused on advanced materials processing and electronics packaging, with a particular emphasis on microwave-based curing technologies. Her most-cited work introduces a modular microwave system designed to selectively cure individual thermosetting polymer packages on a board assembly, offering a targeted alternative to conventional bulk heating methods. This innovation addresses critical challenges in electronics manufacturing by enabling localized, energy-efficient curing that reduces thermal stress on surrounding components. Although her citation count is modest, with her lead paper garnering 2 citations, the work represents a foundational step toward more precise and sustainable packaging processes in the electronics industry. Othman’s research bridges materials science and industrial engineering, contributing to the development of smarter, more adaptable manufacturing techniques. Her contributions are particularly relevant for researchers and engineers seeking to optimize curing processes in microelectronics, where thermal management and component integrity are paramount.
Research Focus
Key Achievements
Top Papers
- 1Modular microwave-based system for packaging applications2 citations · 2010