Frank Eicher

Papers

Total Citations

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About

Frank Eicher is a researcher whose work centers on advanced materials processing and electronics packaging, with a particular emphasis on microwave-based technologies. His major contribution lies in pioneering selective, localized curing methods for thermosetting polymers used in electronics assembly. In his most cited work, "Modular microwave-based system for packaging applications" (2010, 2 citations), Eicher introduced a novel approach that cures individual packages on a board assembly rather than heating the entire substrate—a significant departure from conventional industrial processes. This innovation addresses critical challenges in thermal management and manufacturing efficiency, offering a pathway to more precise, energy-efficient electronics production. While his citation count reflects a focused, early-stage contribution, the conceptual shift he proposed has relevance for modern packaging miniaturization and additive manufacturing. Eicher’s work is notable for its practical engineering insight, bridging materials science and microwave physics to solve real-world assembly constraints. His research continues to inform efforts in modular, scalable curing systems, marking him as a thoughtful contributor to the evolution of electronic packaging technologies.