System in package
相关论文数: 2
顶级研究者
最高引用论文
Ultra High Density Package Design and Electrical Analysis in High Performance Computing Application
Tsun-Lung Hsieh, Hung‐Chun Kuo, Ming-Fong Jhong, Chih-Yi Huang, Chen-Chao Wang
引用数: 4 • 2019
<title>Flip-chip electronic system assembly process and issues for the NanoWalker: a small wireless autonomous instrumented robot</title>
Sylvain Martel, George A. Riley, Monisha Merchant, Ian W. Hunter, S. Lafontaine
引用数: 3 • 1999