Wafer-level packaging

Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires

Miku J. Laakso, Simon J. Bleiker, Jessica Liljeholm, Gustaf Mårtensson, Mikhail Asiatici, Andreas Fischer, Göran Stemme, Thorbjörn Ebefors, Frank Niklaus

Citations: 38 • 2018

Wafer delay analysis and control of dual-armed cluster tools with chamber cleaning operations

Tae-Sun Yu, Tae‐Eog Lee

Citations: 19 • 2019

Emerging needs for continuous flow FOUP transport

Michael D. Brain, Richard D. Gould, U. Kaempf, B. Wehrung

Citations: 15 • 2003

Wafer-level packaged flexible and bendable MEMS accelerometer for robotics and prosthetics

Md Sohel Mahmood, Zeynep Çelik‐Butler, Donald P. Butler

Citations: 6 • 2017

Integration and packaging technology of MEMS-on-CMOS tactile sensor for robot application using molded thick BCB layer and backside-grooved electrical connection

Mitsutoshi Makihata, Shuji Tanaka, Masanori Muroyama, Sakae Matsuzaki, Hiroyuki YAMADA, Takahiro Nakayama, Ui Yamaguchi, Kazuhiro Mima, Yutaka Nonomura, Motohiro Fujiyoshi, Masayoshi Esashi

Citations: 5 • 2011

Integrated Microsystems

Masayoshi Esashi, Shuji Tanaka

Citations: 5 • 2012

Cyclic Scheduling of Single-Arm Cluster Tools with Multiple Wafer Types: A Case Study

Xin Li, Jiongjiong Tian

Citations: 4 • 2022

Scheduling and Control of a Wafer Transfer Robot for Foundry Equipment Innovation Competition

Kai-Tai Song, Song-Qing Ou, Cheng-An Yang, Yu-Xuan Sun, Li-Ren Kang, Zhenyu Wang, Yu-Shin Wang, Pei-Chun Lu, Chun-Long Ko, Yao Hsiang Chen

Citations: 3 • 2019

F A R O S -- Fully Automated Robotic Sorter Cluster Use for Single Wafer Tracking in Semiconductor Manufacturing

F. Heinlein, Alfred A. Kuehn

Citations: 2 • 2006

Development of Thin-Film-Based Sensors for Smart Weldability Estimation of Industrial Solder Tips

Alex Dante, R. P. Rocha, Filipe S. Alves, Valentino Pereira, André Cardoso

Citations: 1 • 2023