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Integration and packaging technology of MEMS-on-CMOS capacitive tactile sensor for robot application using thick BCB isolation layer and backside-grooved electrical connection

Mitsutoshi Makihata, Shuji Tanaka, Masanori Muroyama, Sakae Matsuzaki, Hiroyuki YAMADA, Takahiro Nakayama, Ui Yamaguchi, Kazuhiro Mima, Yutaka Nonomura, Motohiro Fujiyoshi, Masayoshi Esashi

Year: 2012
Citations: 31

Keywords

Wafer dicingMaterials scienceWaferOptoelectronicsCapacitive sensingTactile sensorCapacitanceCMOSMicroelectromechanical systemsSurface micromachining

Integration and packaging technology of MEMS-on-CMOS capacitive tactile sensor for robot application using thick BCB isolation layer and backside-grooved electrical connection

Keywords

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