Sensors for robotic assembly
A. Brennemann, Ralph Hollis, Mark A. Lavin, B.L. Musits
- 发表年份
- 2003
- 引用次数
- 4
摘要
Special-purpose sensors and hybrid mechanical systems have been developed to assemble advanced electronic circuits. State-of-the-art robot systems that are used for electronic assembly and accuracy requirements for the developing surface mount technology are reviewed, showing the need for improved robot positioning capability. Examples of laboratory experiments that demonstrated successful precision assembly or testing using an ordinary robot, a micropositioner, and an optical sensing system are given. These involve fiber-optic sensing, machine-vision endpoint sensing, and hybrid tactic-vision endpoint sensing.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
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