首页 /研究 /3D-Printed Self-Folding Electronics
OTHER

3D-Printed Self-Folding Electronics

Subramanian Sundaram, David Kim, Marc A. Baldo, Ryan C. Hayward, Wojciech Matusik

发表年份
2017
引用次数
118

摘要

Self-transforming structures are gaining prominence due to their general ability to adopt programmed shapes each tailored for specific functions. Composites that self-fold have so far relied on using the stimuli-responsive mechanisms focusing on reversible shape change. Integrating additional functions within these composites can rapidly enhance their practical applicability; however, this remains a challenging problem. Here, we demonstrate a method for spontaneous folding of three-dimensional (3D)-printed composites with embedded electronics at room temperature. The composite is printed using a multimaterial 3D-printing process with no external processing steps. Upon peeling from the print platform, the composite self-shapes itself using the residual forces resulting from polymer swelling during the layer-by-layer fabrication process. As a specific example, electrochromic elements are printed within the composite and can be electrically controlled through its folded legs. Our shape-transformation scheme provides a route to transform planar electronics into nonplanar geometries containing the overhangs. Integrating electronics within complex 3D shapes can enable new applications in sensing and robotics.

关键词

Materials scienceElectronicsPrinted electronicsFlexible electronicsComposite numberFabrication3D printingFolding (DSP implementation)Layer (electronics)Stretchable electronics

相关论文

查看 OTHER 分类全部论文