Wafer bonding
Related papers: 5
Top Researchers
Hiroshi Toshiyoshi
Institution: —
Yoshikazu Arai
Institution: —
Masanori Muroyama
Institution: —
Takahiro Nakayama
Institution: —
Yutaka Nonomura
Institution: —
Motohiro Fujiyoshi
Institution: —
Shuji Tanaka
Institution: —
Mitsutoshi Makihata
Institution: —
Sakae Matsuzaki
Institution: —
Hiroyuki YAMADA
Institution: —
Top Cited Papers
Integration and packaging technology of MEMS-on-CMOS capacitive tactile sensor for robot application using thick BCB isolation layer and backside-grooved electrical connection
Mitsutoshi Makihata, Shuji Tanaka, Masanori Muroyama, Sakae Matsuzaki, Hiroyuki YAMADA, Takahiro Nakayama, Ui Yamaguchi, Kazuhiro Mima, Yutaka Nonomura, Motohiro Fujiyoshi, Masayoshi Esashi
Citations: 31 • 2012
New chip-to-wafer 3D integration technology using hybrid self-assembly and electrostatic temporary bonding
Takafumi Fukushima, H. Hashiguchi, J. C. Bea, Yuki Ohara, M. Murugesan, K.-W. Lee, Tetsu Tanaka, Mitsumasa Koyanagi
Citations: 26 • 2012
A new wafer-bonder of ultra-high precision using surface activated bonding (SAB) concept
Tadatomo Suga, M.M.R. Howlader, Toshihiro Itoh, C. Inaka, Yoshikazu Arai, Akira Yamauchi
Citations: 16 • 2002
3-Layer stacked pixel-parallel CMOS image sensors using hybrid bonding of SOI wafers
Masahide Goto, Yuki Honda, Masakazu Nanba, Yoshinori Iguchi, Takuya Saraya, Masaharu Kobayashi, Eiji Higurashi, Hiroshi Toshiyoshi, Toshiro Hiramoto
Citations: 4 • 2022
Direct Bonding of Multiple Curved, Wedged and Structured Silicon Wafers as X-Ray Mirrors
Boris Landgraf, Ramses Günther, Giuseppe Vacanti, Nicolas M. Barrière, Mark Vervest, David Girou, Alex Yanson, Max Collon
Citations: 2 • 2016