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About

Keju Ji is a leading researcher at the intersection of soft electronics, bioinspired robotics, and advanced adhesive materials. Their work focuses on developing materials and mechanisms that mimic nature’s most remarkable capabilities—from the stretchability of skin to the climbing prowess of geckos and the temperature resilience of desert organisms. Ji’s most influential contribution is the development of highly stretchable, elastic, and ionic conductive hydrogels for artificial soft electronics, a paper that has garnered over 930 citations for its elegant solution to balancing mechanical strength with electrical performance. This foundational work has enabled more durable and flexible wearable devices and soft robots. Building on this, Ji has pioneered bioinspired adhesive systems, including a neural coordination strategy for gecko-like climbing robots and robust, reversible adhesives that function under extreme thermal conditions—from cryogenic cold to high heat. Their recent innovations include biomimetic microstructures for non-destructive handling of brittle materials in high-temperature environments, with applications in semiconductor manufacturing. With a growing portfolio of highly cited papers and patents, Ji is shaping the future of soft robotics, industrial gripping, and adaptive adhesives.