Chengpu Yu

Taiwan Semiconductor Manufacturing Company (Taiwan), Beijing Institute of Technology

Papers

Total Citations

H-Index

About

Chengpu Yu is a leading researcher at the intersection of advanced packaging, autonomous robotics, and nonlinear control systems. His work spans from hardware-level innovations in semiconductor technology to intelligent algorithms for robot exploration and dynamic SLAM. Yu’s most cited paper, “High Performance, High Density RDL for Advanced Packaging” (2018, 43 citations), addresses critical challenges in IoT and cloud computing by enabling faster data transmission and higher bandwidth through redistribution layer (RDL) technology. In robotics, his TDLE framework (2023, 13 citations) introduces hierarchical planning with regional division for efficient 2-D LiDAR exploration, overcoming the limitations of greedy strategies and resource-heavy global solutions. Yu also tackles dynamic environments with DOTF-SLAM (2023), a real-time visual SLAM system that filters key-points and tracks dynamic objects—essential for autonomous driving and multi-robot collaboration. Most recently, his adaptive prescribed-time neural control (2024) offers a novel approach to stabilizing nonlinear systems without traditional backstepping. With contributions spanning hardware, perception, and control, Yu’s work demonstrates a rare ability to bridge theoretical rigor with practical, high-impact engineering solutions.