Papers
4
Total Citations
61
H-Index
3
About
No biography available yet.
Research Focus
Computer science4 · 61 citations
Engineering2 · 56 citations
Layer (electronics)1 · 43 citations
Etching (microfabrication)1 · 43 citations
Chemical-mechanical planarization1 · 43 citations
Electronic engineering1 · 43 citations
Interposer1 · 43 citations
Electrical engineering1 · 43 citations
Dielectric1 · 43 citations
Data transmission1 · 43 citations
Copper interconnect1 · 43 citations
Lithography1 · 43 citations
Key Achievements
3
H-Index
4
Papers
61
Total Citations
15
Avg Citations/Paper
🏆 Most Cited Paper
High Performance, High Density RDL for Advanced Packaging
43 citations · 2018
📈 Most Prolific Year: 2023 (2 Papers)
🤝 Key Collaborators: 17
🏛 Institutions: Taiwan Semiconductor Manufacturing Company (Taiwan), Beijing Institute of Technology
Top Papers
- 1High Performance, High Density RDL for Advanced Packaging43 citations · 2018
- 2
- 3
- 4
Key Collaborators
XZXuyang Zhao2 shared papersEXErpei Xu1 shared papersYLYixuan Liu1 shared papersCTC. T. Wang1 shared papersDCDoug C. H. Yu1 shared papersCSC. S. Liu1 shared papersKYKC Yee1 shared papersZZZilong Zhao1 shared papersZLZhengmao Liu1 shared papersJHJeng-Sheng Hsieh1 shared papersCYC. Y. Hsieh1 shared papersLYLuo‐Ting Yen1 shared papersMLMaolong Lv1 shared papersVCVictor C. Y. Chang1 shared papersYLYixuan Liu1 shared papersCHC.H. Hsieh1 shared papersPWPing Wang1 shared papers
Not generated yet