Wafer dicing

Integration and packaging technology of MEMS-on-CMOS capacitive tactile sensor for robot application using thick BCB isolation layer and backside-grooved electrical connection

Mitsutoshi Makihata, Shuji Tanaka, Masanori Muroyama, Sakae Matsuzaki, Hiroyuki YAMADA, Takahiro Nakayama, Ui Yamaguchi, Kazuhiro Mima, Yutaka Nonomura, Motohiro Fujiyoshi, Masayoshi Esashi

Citations: 31 • 2012

Wafer delay analysis and control of dual-armed cluster tools with chamber cleaning operations

Tae-Sun Yu, Tae‐Eog Lee

Citations: 19 • 2019

Ultra-Thin Silicon based Piezoelectric Capacitive Tactile Sensor

Shoubhik Gupta, Flavio Giacomozzi, Hadi Heidari, Leandro Lorenzelli, Ravinder Dahiya

Citations: 17 • 2016

Surface ESD (ESDFOS) in assembly fab machineries as a functional and reliability risk – Failure analysis, tool diagnosis and on-site-remedies

Peter Jacob

Citations: 6 • 2008

Integration and packaging technology of MEMS-on-CMOS tactile sensor for robot application using molded thick BCB layer and backside-grooved electrical connection

Mitsutoshi Makihata, Shuji Tanaka, Masanori Muroyama, Sakae Matsuzaki, Hiroyuki YAMADA, Takahiro Nakayama, Ui Yamaguchi, Kazuhiro Mima, Yutaka Nonomura, Motohiro Fujiyoshi, Masayoshi Esashi

Citations: 5 • 2011

<title>Multilayered piezoceramic microactuators formed by milling in the green state</title>

Urban Simu, Stefan Johansson

Citations: 3 • 1999

Manufacturing of three-dimensional optical functional surfaces by diamond engraving of RSA 905

Dongya Li, Yang Zhang, Xinquan Zhang, Dennis Wee Keong Neo, Ali Davoudinejad, Guido Tosello

Citations: 2 • 2020