Copper interconnect

Related papers: 1

Top Researchers

Chengpu Yu

Institution: —

Luo‐Ting Yen

Institution: —

C. Y. Hsieh

Institution: —

Jeng-Sheng Hsieh

Institution: —

Victor C. Y. Chang

Institution: —

C.H. Hsieh

Institution: —

C. S. Liu

Institution: —

C. T. Wang

Institution: —

KC Yee

Institution: —

Doug C. H. Yu

Institution: —

Top Cited Papers

High Performance, High Density RDL for Advanced Packaging

Chengpu Yu, Luo‐Ting Yen, C. Y. Hsieh, Jeng-Sheng Hsieh, Victor C. Y. Chang, C.H. Hsieh, C. S. Liu, C. T. Wang, KC Yee, Doug C. H. Yu

Citations: 43 • 2018

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