Multiscale Robotics Framework for MEMS Assembly

Abstract

This paper presents advancement in microassembly and packaging automation accomplished using multiscale robotic platforms. We introduce M <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sup> and mu <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sup> - two unique multiscale platforms (M <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sup> - macro-meso-micro; mu <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sup> $meso-micro-nano). The robots with their corresponding end-effectors are characterized in terms of accuracy, repeatability and resolution in positioning. A typical assembly application in the M <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sup> consists of components whose size range from 126 microns to 25 millimeters and the typical assembly tolerances range from 4 microns to 300 microns. A typical assembly application for mu <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sup> consists of manipulating components mum to 1mm in size, with tolerances between 500nm and 50 mum. The M <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sup> has a macroscale workspace and four high precision robots performing coordinated tasks, vision systems for positioning, calibration and closed-loop control, reconfigurable end-effectors for part pick and place and fixtures such as parts tray and tool rests. The mu <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sup> has a centimeter scale workspace and 3 robots configured into a 3D microassembly station with 19 DOF with coarse motion servos and fine motion piezos, microgrippers and 3D stereo vision. In addition, the mu <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sup> is small enough to be used inside of a scanning electron microscope (SEM). This allows multiscale micro/nano-scale assembly up to a precision of 3 nm. Both multiscale platform stations aim to deliver reconfigurable precision assembly using Labviewtrade based supervisory software modules. Integrated bonding process tools allow for packaging of a variety of different MEMS devices