<title>Positioning strategies and sensor integration in tools for assembling MOEMS</title>

摘要

Assembly is a crucial process during the production of microsystems. Especially automated and economic assembly of flip- chip at small and medium batch sizes is not solved at the moment in industry. For flexible and economic assembly of standard and flip-chip elements a tool was developed, which makes it possible to assemble MOEMS with an accuracy of less than 8 micrometers by a standard industrial robot. This is done by integrating a fine positioning drive and sensors into the tool. Moreover, a special optics module for the assembly of flip-chip elements was developed, which can be used in different positioning devices in a manual and automatic modus.