Instant and Reversible Adhesive-free Bonding Between Silicones and Glossy Papers for Soft Robotics
Takumi Shibuya, Kazuya Murakami, Akitsu Shigetou, Jun Shintake
- 发表年份
- 2026
- 访问权限
- 开放获取
摘要
Integrating silicone with non-extensible materials is a common strategy used in the fabrication of fluidically-driven soft actuators, yet conventional approaches often rely on irreversible adhesives or embedding processes that are labor-intensive and difficult to modify. This work presents silicone-glossy paper bonding (SGB), a rapid, adhesive-free, and solvent-reversible bonding approach that forms robust silicone-paper interfaces simply through contact. The SGB interface withstands high mechanical loads (shear strength > 61 kPa) and can be fully detached and reassembled via ethanol immersion without loss of performance, enabling component reuse and rapid redesign. Characterization studies indicate that surface functional groups primarily govern adhesion on the glossy paper and the modulus of the silicone, while durability and environmental response clarify the conditions for reversible debonding. The results further suggest a synergistic interaction of hydrogen bonding and oligomer diffusion, yielding strong yet reconfigurable adhesion. Soft actuators fabricated using SGB design exhibit equal or greater performance compared to conventional embedded-layer design and enable programmable actuation modes, including contraction, bending, and twisting. By simplifying fabrication while supporting reuse and rapid iteration, SGB offers a scalable and sustainable platform for rapid prototyping in soft robotics.
关键词
相关论文
一种面向线弧增材制造的电动汽车结构可制造性拓扑优化的双环框架
Qiang Cui, Chuan Yu, Daoqian Yang 等 5 位作者
Robotics and Computer-Integrated Manufacturing · 2026
几何数字孪生:一种用于航空发动机装配精度预测的数字智能模型
Ke Shang, Xin Jin, Teli Xu 等 7 位作者
Robotics and Computer-Integrated Manufacturing · 2026
通过人工智能驱动的机器人技术革新产业
Aryan Chaudhary
Recent Advances in Computer Science and Communications · 2026
新型大口径偏置馈电可展开天线设计与动态性能预测
Chuang Shi, Tianming Liu, Ning Xue 等 9 位作者
Aerospace Science and Technology · 2026