Package on package

相关论文数: 1

顶级研究者

Tsun-Lung Hsieh

研究机构: —

Hung‐Chun Kuo

研究机构: —

Ming-Fong Jhong

研究机构: —

Chih-Yi Huang

研究机构: —

Chen-Chao Wang

研究机构: —

最高引用论文

Ultra High Density Package Design and Electrical Analysis in High Performance Computing Application

Tsun-Lung Hsieh, Hung‐Chun Kuo, Ming-Fong Jhong, Chih-Yi Huang, Chen-Chao Wang

引用数: 4 • 2019

相关技术

Computer scienceEngineeringEmbedded systemElectrical engineeringOperating systemMaterials scienceElectronic engineeringLayer (electronics)Printed circuit boardChip