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Scheduling a Single-arm Robotic Cluster Tool with a Condition-based Cleaning Operation

HongPeng Li, QingHua Zhu, Yan Hou

发表年份
2022
引用次数
2

摘要

As wafer circuit widths shrink down, stringent quality control is required during wafer fabrication processes. Therefore, a cleaning operation that removes chemical residuals inside a processing chamber is recently demanded in wafer fabs. To make a trade-off between quality and productivity, a condition-based chamber cleaning in practice is introduced to execute a cleaning operation with a known state of a chamber. Aiming to schedule a time-constrained single-arm cluster tool with a condition-based chamber cleaning operation, we present the necessary and sufficient conditions to check the schedulability of such a cluster tool. Efficient scheduling algorithms for a feasible schedule are derived. An example is given to show the application of the proposed approach.

关键词

WaferWafer fabricationScheduling (production processes)Computer scienceScheduleCluster (spacecraft)Wafer-scale integrationEmbedded systemReal-time computingEngineering

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