首页 /研究 /Advancements in Edible Electronics and Robotics for Smart Food Packaging Processes
OTHER

Advancements in Edible Electronics and Robotics for Smart Food Packaging Processes

Sudhakara Rao J., Gitanjali Behera, K. S. Shreenidhi, Harishchander Anandaram, Gayathri Mani

发表年份
2024
引用次数
3

摘要

This chapter explores recent advancements in edible electronics and robotics for smart food packaging, focusing on sustainability, food safety, and consumer interaction. Edible electronics, designed for human consumption, offer new applications in food quality monitoring, including real-time detection of spoilage, monitoring nutritional content, and product authentication, thereby enhancing food safety Robotics and other technologies will enable innovative functionalities like dynamic packaging responses, automated freshness indicators, and active interventions to extend shelf life. The chapter delves into the intricacies of edible sensors and robotic systems, examining their materials, technologies, design, regulatory, safety, and ethical implications. The study explores the potential of IoT in packaging for supply chain management, personalized nutrition, and waste reduction, highlighting its integration into digital ecosystems, presenting a shift in food distribution, safety, and sustainability.

关键词

ElectronicsRoboticsArtificial intelligenceFood packagingEngineeringComputer scienceElectrical engineeringRobotMechanical engineering

相关论文

查看 OTHER 分类全部论文