Application specific interconnection system for cutting edge packaging technology

摘要

OEI has developed an application specific high-density electrical connector (⩾0.25 mm contact pitch). This pico class connector system can be used in high density electronic packaging to eliminate the I/O bounding problem now being experienced by the introduction of high I/O count devices and the need to connect MEMS and nanotechnology sub-elements into the spacecraft control system. OEI is now addressing critical issues concerning its actual use on Multi-Chip Modules, electronic packaging, spacecraft “Plug and Play” multifunctional structures, robotic vehicles, docking ports and commercialization. These issues include mechanical and thermal integrity, mechanical insertion and removal forces, contact arrangements and optimization for best electrical performance. This means that the system and packaging designer are no longer limited to a few connector selections by allowing customized connectors to be fabricated to enable electronic packaging reductions of 90% over present systems.