Yi Jing Wong

Agency for Science, Technology and Research

Papers

Total Citations

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About

Yi Jing Wong is pioneering the next generation of intelligent, adaptive materials, with a core focus on smart polymeric systems and the thermal management of flexible electronics. Her most impactful work introduces a paradigm shift in adhesion technology through the development of "smart" polymeric adhesives. As detailed in her highly cited 2024 paper, Wong has engineered systems capable of on-demand, reversible switching between "On" and "Off" adhesion states using external triggers like temperature, light, or magnetism. This breakthrough, already garnering 46 citations, holds transformative potential for robotics, healthcare, and manufacturing. Complementing this, Wong has also tackled a critical bottleneck in stretchable electronics: overheating. Her 2024 study on hydrogel encapsulation for high-enthalpy thermal dissipation (33 citations) provides a vital solution for enhancing the thermal and chemical stability of soft, wearable devices. By addressing both the functional intelligence and operational safety of advanced materials, Yi Jing Wong is establishing herself as a leading voice in creating more capable and resilient technologies for the future.