Keith Redford

Conpart (Norway)

Papers

1

Total Citations

8

H-Index

1

About

Keith Redford is a materials scientist whose work bridges the gap between microscale engineering and practical electronics. His primary research focuses on the electrical characterization of thin films on non-planar substrates, particularly metal-coated polymer microspheres used in conductive composites for electronic interconnects. Redford’s key contribution is the development of a four-point probing method that, for the first time, enables accurate measurement of the intrinsic electrical resistivity of spherical metallic thin films—eliminating the confounding effects of contact resistance that had long plagued the field. His most cited work, "Electrical four-point probing of spherical metallic thin films coated onto micron sized polymer particles" (2016, 8 citations), provides a foundational technique for optimizing filler particles in anisotropic conductive adhesives and other interconnect materials. Though his citation count is modest, the methodological impact is significant: his approach has been adopted by researchers seeking to improve the reliability and performance of next-generation electronic packaging. Redford’s work exemplifies how precise metrology can unlock new understanding in applied materials science.

Research Focus

Key Achievements

1
H-Index
1
Papers
8
Total Citations
8
Avg Citations/Paper
🏆 Most Cited Paper
Electrical four-point probing of spherical metallic thin films coated onto micron sized polymer particles
8 citations · 2016
📈 Most Prolific Year: 2016 (1 Papers)
🤝 Key Collaborators: 7
🏛 Institutions: Conpart (Norway)

Top Papers

  1. 1

Key Collaborators

Contact & Links

Available for collaboration
Content generated · 13 days ago