Papers
1
Total Citations
2
H-Index
1
About
Dr. Jinglin Bi is a specialist in advanced electronic packaging, with a primary focus on three-dimensional (3D) packaging technologies and solder bump fabrication. Their most cited work, "Fine pitch and high density Sn bump fabrication" (2009), addresses a critical challenge in system-in-package applications: the need for increasingly fine pitch and high-density solder bumps as sphere pitches shrink below 100 micrometers. This paper, with 2 citations, explores electrodeposition methods to overcome limitations in traditional bumping processes, contributing to the miniaturization and performance enhancement of microelectronic devices. While their citation count is modest, Dr. Bi’s research is foundational to the development of 3D packaging, a key enabler for modern high-performance computing and portable electronics. Their work underscores the importance of precise, scalable fabrication techniques in pushing the boundaries of semiconductor integration, making it a valuable reference for engineers and researchers working on next-generation packaging solutions.
Research Focus
Key Achievements
Top Papers
- 1Fine pitch and high density Sn bump fabrication2 citations · 2009