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Resolving Thermal Accumulation and Rigid-Soft Interface Mismatch in Stretchable Electronics with Cubic Boron Nitride Composite Islands.

Shan Q, Zhang Y, Zhu Z, Ren Q, Huang P, Wang W, Deng D, Cao Y, Hou D

Year
2026
Journal
ACS applied materials & interfaces

Keywords

stretchable electronicsthermal managementcubic boron nitriderigid-soft interfacecomposite islands

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