Advanced micro-dispensing system for conductive adhesives

Abstract

As part of this paper, systems suitable for the micro-dispensing of conductive adhesives are presented and their advantages and disadvantages are also discussed. Additionally, cause-and-effect correlations of various influencing parameters are presented and analyzed, both for dispensing systems and for robotics. A further central theme is made up by the geometries of suitable needles for the precision dispensing of conductive adhesives. In closing, a new technique developed at the Fraunhofer IPA for the high-accuracy dispensing of conductive epoxy resins is presented. The most important part of the new system is a micro-pump system combined with pneumatic micro-valve actuators.