On-chip calibration of Microscale-Thermocouples for Precise Temperature Measurement
Hassan Irshad Bhatti
- Year
- 2025
- Access
- Open access
Abstract
Precise temperature measurement at micro/nanoscale is crucial across various domains including physical sciences, chemical processes, industrial production, medical diagnosis, weather forecasting, electronics, and biology. Micro/nanoscale thermal mapping requires precise techniques such as thermocouples, resistance-based devices, infrared thermography, optical interferometry, Raman thermometry, and Time domain-thermoreflectance (TDTR) method. Each method has its advantages and limitations, emphasizing the importance of selecting the appropriate technique. Among these methods, micro-thin film thermocouples (TFTCs) offer a compelling solution due to their direct contact-based temperature measurements, minimal surface preparation requirements, lower cost, and robustness against environmental factors. Thermocouples work on the well-established Seebeck effect, where a voltage is generated proportional to the temperature difference between two points. However, at micro/nanoscale, the Seebeck coefficients of thermocouples differ from those in bulk materials, requiring experimental calibration for precise measurements. To address this, we introduce an on-chip characterization platform with a differential temperature measurement setup on a borosilicate glass substrate. This platform utilizes a microheater as a localized heat source to elevate the temperature at the hot junction of the TFTC while maintaining the cold junction at ambient conditions. Numerical simulations are employed to engineer both the microheater and TFTC junction for precise temperature control. The functionality of this platform is validated by fabricating TFTCs using standard fabrication processes and measuring the TFTC response to determine the differential Seebeck coefficient of a Platinum-Chromium TFTC Junction. The calculated sensitivity of Pt/Cr TFTCs using this calibration method is 19.23 +- 0.405 μV/C.
Keywords
Related papers
A dual-loop framework for manufacturability-aware topology optimization of electric vehicle structures via wire arc additive manufacturing
Qiang Cui, Chuan Yu, Daoqian Yang +2 more
Robotics and Computer-Integrated Manufacturing · 2026
Geometric digital twin: A digital and intelligent model for aero-engine assembly accuracy prediction
Ke Shang, Xin Jin, Teli Xu +4 more
Robotics and Computer-Integrated Manufacturing · 2026
Design and dynamic performance prediction of a novel large-aperture offset-feed deployable antenna
Chuang Shi, Tianming Liu, Ning Xue +6 more
Aerospace Science and Technology · 2026
Revolutionizing Industries Through AI-Driven Robotics
Aryan Chaudhary
Recent Advances in Computer Science and Communications · 2026