MCF (Magnetic Compound Fluid) Polishing Process for Free-formed Resin Device using Robotic Arm
Yawen Wu, Takashi Satō, Weimin Lin, Ken Yamamoto, Kunio Shimada, Francisco Chinesta, Yvan Chastel, Mohamed El Mansori
- 发表年份
- 2011
- 引用次数
- 4
摘要
The automatic polishing process for three‐dimensional forms, such as prototype models of products made of acrylic resin, are being required to develop in order to reduce cost and time consumption. This paper proposes a new polishing technique using magnetic compound fluid (MCF) and robotic arm. Firstly, a polishing unit, which can generate a dynamic magnetic field and be attachable to the robotic arm, is developed. This unit can hold MCF slurry that acts as a flexible and restorable polishing tool for the sake of magnetic force. Secondly, the effects of the clearance between workpiece and polishing unit, the composition of MCF slurry, the relative motion, the dynamic magnetic field and the supplied amount of slurry on polishing characteristics of acrylic resin are experimentally demonstrated. As a result, the smoothest surface roughness is achieved to below 10 nm Ra in a few min, and the feasibility of polishing the free‐formed device by controlling robotic arm has been confirmed.
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