Learning 2D Invariant Affordance Knowledge for 3D Affordance Grounding
Xianqiang Gao, Pingrui Zhang, Delin Qu, Dong Wang, Zhigang Wang, Yan Ding, Bin Zhao
- 发表年份
- 2024
- 访问权限
- 开放获取
摘要
3D Object Affordance Grounding aims to predict the functional regions on a 3D object and has laid the foundation for a wide range of applications in robotics. Recent advances tackle this problem via learning a mapping between 3D regions and a single human-object interaction image. However, the geometric structure of the 3D object and the object in the human-object interaction image are not always consistent, leading to poor generalization. To address this issue, we propose to learn generalizable invariant affordance knowledge from multiple human-object interaction images within the same affordance category. Specifically, we introduce the Multi-Image Guided Invariant-Feature-Aware 3D Affordance Grounding (MIFAG) framework. It grounds 3D object affordance regions by identifying common interaction patterns across multiple human-object interaction images. First, the Invariant Affordance Knowledge Extraction Module (IAM) utilizes an iterative updating strategy to gradually extract aligned affordance knowledge from multiple images and integrate it into an affordance dictionary. Then, the Affordance Dictionary Adaptive Fusion Module (ADM) learns comprehensive point cloud representations that consider all affordance candidates in multiple images. Besides, the Multi-Image and Point Affordance (MIPA) benchmark is constructed and our method outperforms existing state-of-the-art methods on various experimental comparisons.
关键词
相关论文
一种面向线弧增材制造的电动汽车结构可制造性拓扑优化的双环框架
Qiang Cui, Chuan Yu, Daoqian Yang 等 5 位作者
Robotics and Computer-Integrated Manufacturing · 2026
几何数字孪生:一种用于航空发动机装配精度预测的数字智能模型
Ke Shang, Xin Jin, Teli Xu 等 7 位作者
Robotics and Computer-Integrated Manufacturing · 2026
通过人工智能驱动的机器人技术革新产业
Aryan Chaudhary
Recent Advances in Computer Science and Communications · 2026
新型大口径偏置馈电可展开天线设计与动态性能预测
Chuang Shi, Tianming Liu, Ning Xue 等 9 位作者
Aerospace Science and Technology · 2026