Concepts and requirements for semiconductor multiprocess integration in vacuum

Abstract

The requirements for front end process automation in the semiconductor industry have led to the development of modular, isolation transport systems. Such equipment enables batch load locking as well as serial processing and Scanning Electron Microscopy inspection of wafers.As multiprocess integration in vacuum gains acceptance in the semiconductor industry, the concept of space saving, high throughput networks must be considered. The sucessful implementation of such networks is, to a large extent, contingent upon the efficiency, cleanliness, and reliability of the wafer transport system(s).Examples of vacuum process integration are shown, and a concept for high throughput networking by means of modular isolation transport systems with redundant wafer routing, is presented. A comprehensive reliability study on a vacuum robot is also reviewed.