Suppressing Acoustomigration and Temperature Rise for High-power Robust Acoustics
Fangsheng Qian, Shuhan Chen, Wei Wei, Jiashuai Xu, Kai Yang, Junyan Zheng, Zijun Ren, Xingyu Liu, Yansong Yang
- Year
- 2026
- Access
- Open access
Abstract
High-frequency acoustic wave transducers, vibrating at gigahertz (GHz), favored for their compact size, are not only dominating the front-end of mobile handsets but are also expanding into various interdisciplinary fields, including quantum acoustics, acoustic-optics, acoustic-fluids, acoustoelectric, and sustainable power conversion systems. However, like strong vibration can "shake off" substances and produce heat, a long-standing bottleneck has been the ability to harness acoustics under high-power vibration loads, while simultaneously suppressing temperature rise, especially for IDT-based surface acoustic wave (SAW) systems. Here, we proposed a layered acoustic wave (LAW) platform, utilizing a quasi-infinite multifunctional top layer, that redefines mechanical and thermal boundary conditions to overcome three fundamental challenges in high-power acoustic wave vibration: self-heating, thermal instability, and acoustomigration. By simply leveraging a simplified, thick single-material overlayer to achieve electro-thermo-mechanical co-design, this acoustic platform moves beyond prior substrate-focused thermal management in SAW technology. It demonstrates, for the first time from the top boundary, simultaneous redistribution of the von Mises stress field and the creation of an efficient vertical thermal dissipation path. The LAW transducer, vibrating at over 2 GHz, achieves a 70% reduction in temperature rise under identical power loads, a first-order temperature coefficient of frequency (TCF) of -13 ppm/C with minimal dispersion, and an unprecedented threshold power density of 45.61 dBm/mm2 - over one order-of-magnitude higher than that of state-of-the-art thin-film surface acoustic wave (TF-SAW) counterparts at the same wavelength.
Keywords
Related papers
A dual-loop framework for manufacturability-aware topology optimization of electric vehicle structures via wire arc additive manufacturing
Qiang Cui, Chuan Yu, Daoqian Yang +2 more
Robotics and Computer-Integrated Manufacturing · 2026
Geometric digital twin: A digital and intelligent model for aero-engine assembly accuracy prediction
Ke Shang, Xin Jin, Teli Xu +4 more
Robotics and Computer-Integrated Manufacturing · 2026
Revolutionizing Industries Through AI-Driven Robotics
Aryan Chaudhary
Recent Advances in Computer Science and Communications · 2026
Design and dynamic performance prediction of a novel large-aperture offset-feed deployable antenna
Chuang Shi, Tianming Liu, Ning Xue +6 more
Aerospace Science and Technology · 2026