Quad Flat No-leads package
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Highly Thermal Dissipation for Large HPC Package Using Liquid Metal Materials
Yu Lung Huang, C. Key Chung, C. F. Lin, Kuo Haw Yu, Rung Jeng Lin, Wilson Hong
引用数: 6 • 2021
相关论文数: 1
Highly Thermal Dissipation for Large HPC Package Using Liquid Metal Materials
Yu Lung Huang, C. Key Chung, C. F. Lin, Kuo Haw Yu, Rung Jeng Lin, Wilson Hong
引用数: 6 • 2021