Smart Mechanical Structures and Design for Advanced Adhesives: A Review
J.S. Kim, Geonjun Choi, Seongjin Park, Minwook Kim, Kwangjun Kim, Ho‐Sup Jung, Moon Kyu Kwak, Jong G. Ok, Hoon Eui Jeong
- 发表年份
- 2025
- 引用次数
- 1
- 访问权限
- 开放获取
摘要
Abstract Smart adhesives with engineered mechanical structures have emerged as a transformative technology with broad applications in fields such as wearable healthcare devices, bioengineering, and soft robotics. By integrating advanced mechanical architectures like kirigami, tessellations, and multilayered designs, these adhesives exhibit enhanced surface and mechanical properties that lead to superior interfacial adhesion. Such designs offer critical advantages—improved stretchability, substrate conformability, and increased adhesion strength—over conventional adhesives. This review explores the range of engineered structures used in smart adhesives and demonstrates how these innovations address the limitations of traditional adhesives. Additionally, we discuss their applications in wearable healthcare devices, flexible electronics, and robotics.
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