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Applications '90: industrial electronics

Gadi Kaplan

发表年份
1990
引用次数
2

摘要

Advances in industrial electronics during 1989 are described. These include: the use of X-ray scanning-beam laminography to check solder joints on printed-circuit boards; pressure microsensors based on changing resonance frequency by applied force; emergence of the service industry as a market for robots; a computerized facility that allows rapid acquisitions of manufactured parts; and increased use of modular integrated power functions in power electronics systems.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">&gt;</ETX>

关键词

ElectronicsPower electronicsModular designManufacturing engineeringElectrical engineeringRobotEngineeringIndustrial robotPrinted circuit boardMechanical engineering

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