PREFACE

摘要

Toward realization of carbon neutral in 2050, promotion of energy saving and maximum utilization of renewable energy are required. It is thus necessary to make innovation in power electronics technology to support electricity demand from power supply. Next generation power semiconductors such as SiC, GaN and Ga 2 O 3 are expected to be applied extensively for electric vehicles, industrial robots, household appliances, telecommunication apparatus and so on. Electronics packaging is key technology to draw out the superior characteristic of the semiconductor devices. Researches of interconnect materials for electronics packaging that were actively conducted in 1990's with a main focus on developing lead-free solders are now rekindled due to a growing demand for development of various electronics systems. In the field of electric vehicles, it is necessary to develop high temperature resistant interconnect materials such as high temperature solder alloys as a die attach material for power semiconductor devices and sintering bonding technology with the use of metal nanoparticles. In autonomous driving technology of vehicles, which development and promotion are now underway, high reliability packaging technology for automotive sensors capable of withstanding a long-time use is now required. For power semiconductor devices and future sophisticated automotive electronics systems, in addition to developing a new packaging material, a dissimilar bonding method with resin and so on, reliable test data of the newly developed materials and joints such as fatigue and creep are required and it is desired that method for longterm life predictions through computer simulations using the test data is established. In the automotive electronics that demand high temperature resistance and long-term reliability, investigations that have been conducted so far on interconnect technologies for consumer electronics products are not sufficient. In fact, it is indispensable to conduct highly sophisticated investigations by taking a more theoretical or scientific approach than ever. In the consumer products, there is a demand for low temperature bonding technology to reduce the effects on environment and it is expected that packaging technologies using low-temperature bonding are established. While there are many research problems around interconnect materials for electronics packaging, the domestic academia is not much interested in the field of electronics packaging. It is expected that more researchers participate in this field.