Proceedings of the 5th international SAMPE electronics conference

摘要

On the materials side, a comprehensive survey of recent work in ceramics, resins and polymers, adhesives and encapsulants, and composites has been assembled. From a process perspective, new developments in failure analysis, testing, robotics and assembly are presented. Integrating both of these facets are papers addressing printed circuitry and thin film microelectronics. These papers reflect our rapidly changing world, the new and the challenging, the progress of today.