DNA assisted micro-assembly: A heterogeneous integration technology for optoelectronics

摘要

The integration of optoelectronic and electronic components from different origins and substrates makes possible many advanced systems in diverse applications in photonics. To this end, various hybrid integration technologies including flip-chip bonding, epitaxial lift-off and direct bonding, substrate removal and “appliqué ” bonding, micro-robotic pick and place, and self-assembly methods have been explored. In this paper, we will briefly describe and evaluate these approaches for their applications in optoelectronics and focus on a new micro-assembly technology that can pick, place, and bond many devices of different origins and dimensions simultaneously in a parallel fashion on very large surfaces. We will present some of our preliminary results demonstrating the feasibility of this DNA-assisted micro-assembly technique. In the context of hardware development, “Heterogeneous Integration ” (HI) techniques refer to a body of processes and methods that are used to bring together in a highly integrated fashion, structures at the chip (circuit), device, or material levels which cannot be fabricated together using conventional processing techniques due to geometric or