Solder Paste Dispensing in Robotic SMD Rework

摘要

Although rework is labour intensive and conflicts with most modern manufacturing/assembly philosophies, realistic defect levels in surface mount technology (SMT) printed circuit board (PCB) assembly render rework indispensable on the shop floor. Most commercially available rework tools are manual or require very skilled operators for their efficient operation. The challenges of automating SMD rework are significant because the tools, their specifications and rework processes required are not fully understood, and the impact of rework processes on assembly quality and reliability are hotly debated. This paper describes an automated robotic rework cell for SMD and TH boards, and the method used for process characterisation of the solder paste dispensing system. The paper also describes equipment selection, the integration and interfacing of the dispensing equipment to the cell controller and the process characterisation experiments.