OTHER
Analytical and Experimental Research on Assembly Systems for Molded Interconnection Devices (3D-MID)
Klaus Feldmann, A. Brand
- 发表年份
- 1994
- 引用次数
- 16
关键词
SolderabilityInterconnectionSolderingMechanical engineeringPrinted circuit boardWork (physics)SMT placement equipmentRobotManufacturing engineeringThermoplastic
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